CaseySJ
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I would like to see a photo of the wafer itself. There are at least two ways to fabricate the M1 Ultra. Because the two M1 Max SoCs are rotated 180 degrees with respect to each other, it imposes some manufacturing constraints.
- A multi-die reticle can be used in which two M1 Max die are etched in the rotated fashion. The lithography tool (immersion or EUV scanner) will step across the wafer, exposing this dual configuration at each step. So we’ll clearly see these pairs of rotated die on the wafer. It’s possible to include the UltraFusion fabric on the same reticle, but that means the two M1 Max die are — from a manufacturing perspective— a single monolithic die. This affects yield rates.
- Another option is to use a single die reticle with the UltraFusion fabric on one side of the SoC. All die are exposed on the wafer in the same orientation and hence there are no visible die pairs on the wafer. The wafer will look homogeneous. This approach means that the process of rotating and fusing two M1 Max die is done at the packaging step and not at the wafer fabrication step.
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